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- [34] RF characterization of mold compound materials and high-Q integrated passives using fan-out wafer-level packaging technology 2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2019, : 103 - 106
- [35] Micro Ball Mount Process for High Performance Fan-Out Large Panel Level Packaging Back-end Process 2023 International Conference on Electronics Packaging, ICEP 2023, 2023, : 65 - 66
- [36] Power Saving and Noise Reduction of 28nm CMOS RF System Integration Using Integrated Fan-Out Wafer Level Packaging (InFO-WLP) Technology 2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015), 2015,
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