High Speed Signal Design on Fan-Out RDL Interposer for Artificial Intelligence (AI) and Deep Neural Network (DNN) Chiplet Accelerators Application

被引：0
|
作者：
Zhuang, Ming-Han [1 ]
Shih, Chih-Yuan [1 ]
Lin, Ho-Chuan [1 ]
Kang, Andrew [1 ]
Wang, Yu-Po [1 ]
机构：
[1] Siliconware Precision Industries Co., Ltd., Taiwan
来源：
2024 International Conference on Electronics Packaging, ICEP 2024 | 2024年
关键词：
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I：
暂无
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学科分类号：
摘要：
Chip scale packages - Deep neural networks - Integrated circuit interconnects - Learning systems - Signal processing
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页码：275 / 276
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