AC TDDB Analysis for Circuit-Level Gate Oxide Wearout Reliability Assessment

被引:0
|
作者
Kopley, T. E. [1 ]
O'Brien, K.
Chang, W. -C. [1 ]
机构
[1] ON Semicond, Sunnyvale, CA 94089 USA
关键词
BREAKDOWN;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present a framework for circuit-level and application-level gate oxide wearout analysis using a quasi-static AC Time-Dependent Dielectric Breakdown (TDDB) model. The method can assess the gate oxide wearout rate for analog circuit blocks operating in normal or extreme conditions in the field. It can also be used to assess gate-oxide wearout rates for discrete MOSFETs, IGBTs, or any other device with a gate oxide, operated in specific applications. The model has been implemented in Matlab and R as well as Cadence design tools, the latter to allow circuit designers to do quick reliability assessments on their designs. As part of this framework, we introduce gate oxide failure rate versus operating time plots, which offer a concise picture of the amount of failures expected in the field due to gate oxide wearout. This allows designers and product engineers to assess the reliability of a product in terms of ppm failure rates with time in operation.
引用
收藏
页码:73 / 76
页数:4
相关论文
共 50 条
  • [1] Combined Vramp and TDDB Analysis for Gate Oxide Reliability Assessment and Screening
    Kopleya, T. E.
    Ring, M.
    Choi, C.
    Colbath, J.
    [J]. 2015 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP (IIRW), 2015, : 138 - 142
  • [2] A circuit-level perspective of the optimum gate oxide thickness
    Bowman, KA
    Wang, LH
    Tang, XH
    Meindl, JD
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (08) : 1800 - 1810
  • [3] On the Circuit-Level Reliability Degradation Due to AC NBTI Stress
    Chenouf, Amel
    Djezzar, Boualem
    Benabdelmoumene, Abdelmadjid
    Tahi, Hakim
    [J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2016, 16 (03) : 290 - 297
  • [4] Memory Reliability Estimation Degraded by TDDB Using Circuit-Level Accelerated Life Test
    Kim, Dae-Hyun
    Milor, Linda
    [J]. 2017 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2017,
  • [5] CIRCUIT-LEVEL SIMULATION OF TDDB FAILURE IN DIGITAL CMOS CIRCUITS
    MINAMI, ER
    KUUSINEN, SB
    ROSENBAUM, E
    KO, PK
    HU, CM
    [J]. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1995, 8 (03) : 370 - 374
  • [6] Circuit-level delay modeling considering both TDDB and NBTI
    Luo, Hong
    Chen, Xiaoming
    Velamala, Jyothi
    Wang, Yu
    Cao, Yu
    Chandra, Vikas
    Ma, Yuchun
    Yang, Huazhong
    [J]. 2011 12TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED), 2011, : 14 - 21
  • [7] Experiments and models for circuit-level assessment of the reliability of Cu metallization
    Thompson, CV
    Gan, CL
    Alam, SM
    Troxel, DE
    [J]. PROCEEDINGS OF THE IEEE 2004 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2004, : 69 - 71
  • [8] A Triple-Point Model for Circuit-Level Reliability Analysis
    Chen, Chunhong
    Cai, Jinchen
    Zhan, Suoyue
    [J]. 2018 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2018,
  • [9] A unified compact model of the gate oxide reliability for complete circuit level analysis
    Lee, Chi-Hwan
    Yang, Gi-Young
    Park, Jin-Kyu
    Park, Young-Kwan
    Kim, Hyung-Wook
    Park, Donggun
    Yoo, Moon-Hyun
    [J]. 2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2, 2007, : 549 - +
  • [10] Circuit-level reliability requirements for Cu metallization
    Alam, SM
    Gan, CL
    Wei, FL
    Thompson, CV
    Troxel, DE
    [J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2005, 5 (03) : 522 - 531