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- [21] Yield Improvement and Test Cost Optimization for 3D Stacked ICs 2011 20TH ASIAN TEST SYMPOSIUM (ATS), 2011, : 480 - 485
- [22] Challenges in Testing TSV-Based 3D Stacked ICs: Test Flows, Test Contents, and Test Access PROCEEDINGS OF THE 2010 IEEE ASIA PACIFIC CONFERENCE ON CIRCUIT AND SYSTEM (APCCAS), 2010, : 544 - 547
- [23] Test Scheduling in an IEEE P1687 Environment with Resource and Power Constraints 2011 20TH ASIAN TEST SYMPOSIUM (ATS), 2011, : 525 - 531
- [26] The left edge algorithm in block test scheduling under power constraints ISCAS 2000: IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS - PROCEEDINGS, VOL I: EMERGING TECHNOLOGIES FOR THE 21ST CENTURY, 2000, : 351 - 354
- [27] Enabling SPICE-type modeling of the thermal properties of 3D-stacked ICs EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 492 - 499