共 50 条
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- [4] A Distributed, Reconfigurable, and Reusable BIST Infrastructure for 3D-Stacked ICs 2014 IEEE INTERNATIONAL TEST CONFERENCE (ITC), 2014,
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- [6] Efficient Test Scheduling for Reusable BIST in 3D Stacked ICs 2017 INTERNATIONAL CONFERENCE ON ADVANCES IN COMPUTING, COMMUNICATIONS AND INFORMATICS (ICACCI), 2017, : 1349 - 1355
- [7] A DLL-Based Test Solution for Through Silicon Via (TSV) in 3D-Stacked ICs 2015 IEEE INTERNATIONAL TEST CONFERENCE (ITC), 2015,
- [8] Optimal Test Scheduling of Stacked Circuits Under Various Hardware and Power Constraints 2015 28TH INTERNATIONAL CONFERENCE ON VLSI DESIGN (VLSID), 2015, : 487 - 492
- [9] On Effective TSV Repair for 3D-Stacked ICs DESIGN, AUTOMATION & TEST IN EUROPE (DATE 2012), 2012, : 793 - 798
- [10] Temperature-Gradient Based Test Scheduling for 3D Stacked ICs 2013 IEEE 20TH INTERNATIONAL CONFERENCE ON ELECTRONICS, CIRCUITS, AND SYSTEMS (ICECS), 2013, : 405 - 408