Power, Performance, and Cost Comparisons of Monolithic 3D ICs and TSV-based 3D ICs

被引：0

作者：

Nayak, Deepak Kumar ^{[1
]}

Banna, Srinivasa ^{[1
]}

Samal, Sandeep Kumar ^{[2
]}

Lim, Sung Kyu ^{[2
]}

机构：

[1] GLOBALFOUNDRIES, Technol Res, 2600 Great Amer Way, Santa Clara, CA 95054 USA

[2] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

2015 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) | 2015年

关键词：

3D IC; Monolithic; 3D; TSV; PPA; PPC; Cost;

D O I：

暂无

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

Power, performance, area, and cost analysis of TSV, mini-TSV, and monolithic 3D ICs is presented. Power savings for TSV, mini-TSV, and monolithic 3D ICs are 21%, 25%, and 37/0, respectively, compared to that of a 2D IC. It is shown that monolithic 3D can deliver one node PPC benefit, whereas TSV 3D or mini-TSV 3D can only achieve a half node PPC advantage.

引用

页数：2

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