Power, Performance, and Cost Comparisons of Monolithic 3D ICs and TSV-based 3D ICs

被引：0
|
作者：
Nayak, Deepak Kumar [1 ]
Banna, Srinivasa [1 ]
Samal, Sandeep Kumar [2 ]
Lim, Sung Kyu [2 ]
机构：
[1] GLOBALFOUNDRIES, Technol Res, 2600 Great Amer Way, Santa Clara, CA 95054 USA
[2] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
2015 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) | 2015年
关键词：
3D IC; Monolithic; 3D; TSV; PPA; PPC; Cost;
D O I：
暂无
中图分类号：
TP301 [理论、方法];
学科分类号：
081202 ;
摘要：
Power, performance, area, and cost analysis of TSV, mini-TSV, and monolithic 3D ICs is presented. Power savings for TSV, mini-TSV, and monolithic 3D ICs are 21%, 25%, and 37/0, respectively, compared to that of a 2D IC. It is shown that monolithic 3D can deliver one node PPC benefit, whereas TSV 3D or mini-TSV 3D can only achieve a half node PPC advantage.
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页数：2
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