Empirical modeling of oxide CMP at chip scale

被引：3
|
作者：
Wolf, H [1 ]
Streiter, R
Rzehak, R
Meyer, F
Springer, G
机构：
[1] Fraunhofer Inst Reliabil & Microintegrat, Dept Micro Devices & Equipment, D-09126 Chemnitz, Germany
[2] Infineon Technol, D-01099 Dresden, Germany
来源：
MICROELECTRONIC ENGINEERING | 2005年 / 82卷 / 3-4期
关键词：
oxide CMP; modeling; chip scale;
D O I：
10.1016/j.mee.2005.07.085
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We present an extension of the density-step height model for pattern effects in oxide chemical mechanical planarization. The model is compared to polishing data for processes using different pressure and speed. Agreement with the data is improved especially in the initial regime of polishing before the pad contacts down the areas. Implications for process optimization are discussed. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码：686 / 694
页数：9
相关论文
共 50 条
  • [21] Chip Scale Package (CSP) solder joint reliability and modeling
    Amagai, M
    MICROELECTRONICS RELIABILITY, 1999, 39 (04) : 463 - 477
  • [22] Chip Scale Package (CSP) solder joint reliability and modeling
    Amagai, M
    1998 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 36TH ANNUAL, 1998, : 260 - 268
  • [23] An Industrial-Scale, Multi-Wafer CMP Simulation Using the PAML Modeling Approach
    Srivastava, Gagan
    Higgs, C. Fred, III
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2015, 4 (11) : P5088 - P5096
  • [24] On the CMP material removal at the molecular scale
    Chang, L.
    JOURNAL OF TRIBOLOGY-TRANSACTIONS OF THE ASME, 2007, 129 (02): : 436 - 437
  • [25] Scratch Reduction in Oxide CMP Process
    Ohtsuka, Yosuke
    2011 INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING (ISSM) AND E-MANUFACTURING AND DESIGN COLLABORATION SYMPOSIUM (EMDC), 2011,
  • [26] Cleaning after silicon oxide CMP
    Tardif, F
    Constant, I
    Lardin, T
    Demolliens, O
    Fayolle, M
    Gobil, Y
    Palleau, J
    Torres, J
    MICROELECTRONIC ENGINEERING, 1997, 37-8 (1-4) : 285 - 291
  • [27] Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design
    Waelchli, R.
    Brunschwiler, T.
    Michel, B.
    Poulikakos, D.
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2010, 53 (5-6) : 1004 - 1014
  • [28] Empirical and scale-up modeling in stirred ball mills
    Mannheim, V.
    CHEMICAL ENGINEERING RESEARCH & DESIGN, 2011, 89 (4A): : 405 - 409
  • [29] Empirical Modeling of Iron Oxide Dissolution in Sulphuric and Hydrochloric Acid
    Jan C. Hemmelmann
    Hao Xu
    Wolfgang Krumm
    Metallurgical and Materials Transactions B, 2013, 44 : 1232 - 1235
  • [30] EMPIRICAL MODELING AND SCALE-UP OF A SEMIBATCH POLYESTRIFICATION PROCESS
    DAIRANIEH, IS
    KHRAISHI, N
    JOURNAL OF APPLIED POLYMER SCIENCE, 1991, 42 (06) : 1631 - 1637
12345