Modeling and simulation of stress-induced leakage current in ultrathin SiO2 films

被引:164
|
作者
Ricco, B [1 ]
Gozzi, G [1 ]
Lanzoni, M [1 ]
机构
[1] Univ Bologna, DEIS, I-40136 Bologna, Italy
关键词
MOS capacitors; reliability; SILC; thin oxides; tunnel injection;
D O I
10.1109/16.701488
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a new model for stress-induced leakage current (SILC) in ultrathin SiO2 films, that is able to explain and accurately represent the experimental data obtained with MOS capacitors fabricated with different technologies and oxide thickness in the 3-7 nm range.
引用
收藏
页码:1554 / 1560
页数:7
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