SPECIAL ISSUE: MICRO/NANOELECTRONICS AND NEMS AND MEMS PACKAGING Foreword

被引：0
|
作者：
Basaran, Cemal [1 ]
Ye, Hua [2 ]
机构：
[1] SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
[2] Microsoft Corp, Redmond, WA 98052 USA
来源：
INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY | 2009年 / 34卷 / 1-2期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
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页码：1 / 2
页数：2
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