Special Section On Micro- And Nanoscale Packaging - Foreword

被引：1
|
作者：
Lee, YC [1 ]
Albert, J
Velten, T
Hancock, WO
机构：
[1] Univ Colorado, Boulder, CO 80302 USA
[2] Motorola Inc, Deer Pk, IL 60010 USA
[3] IBMT, D-66386 St Ingbert, Germany
[4] Penn State Univ, University Pk, PA 16802 USA
来源：
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2005年 / 28卷 / 04期
关键词：
D O I：
10.1109/TADVP.2005.860786
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：531 / 532
页数：2
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