SPECIAL SECTION ON PACKAGING - FOREWORD

被引：0
|
作者：
BALDE, JW
SEGELKEN, JM
KNAUSENBERGER, WH
机构：
[1] AT&T BELL LABS,600 MT AVE,MURRAY HILL,NJ 07974
[2] AT&T BELL LABS,WHIPPANY,NJ 07981
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1992年 / 15卷 / 01期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：5 / 6
页数：2
相关论文
共 50 条
  • [1] SPECIAL SECTION ON PACKAGING - FOREWORD
    LI, CY
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (03): : 241 - 241
  • [2] SPECIAL SECTION ON PACKAGING - FOREWORD
    BALDE, JW
    KNAUSENBERGER, WH
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (02): : 141 - 142
  • [3] SPECIAL SECTION ON ELECTRONIC PACKAGING - FOREWORD
    DOANE, DA
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (03): : 536 - 537
  • [4] Special section on microsystems design and packaging - Foreword
    Hsu, TR
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (04): : 594 - 595
  • [5] Special Section On Micro- And Nanoscale Packaging - Foreword
    Lee, YC
    Albert, J
    Velten, T
    Hancock, WO
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (04): : 531 - 532
  • [6] SPECIAL SECTION ON ELECTRONIC PACKAGING OF THE 1990S - FOREWORD
    SEGELKEN, JM
    KNAUSENBERGER, W
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (02): : 253 - 253
  • [7] FOREWORD TO SPECIAL SECTION ON ELECTRONIC PERFORMANCE-CHARACTERISTICS OF PACKAGING STRUCTURES
    PRINCE, J
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (04): : 466 - 466
  • [8] Special Section on Packaging for Micro/Nano-Scale Systems Foreword
    Chiou, J. Albert
    Lee, Y. C.
    Kurabayashi, Katsuo
    Candler, Robert N.
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 32 (02): : 399 - 401
  • [9] Foreword for Special Section
    Casas, Dan
    Jarabo, Adrián
    [J]. 29th Spanish Computer Graphics Conference, CEIG 2019, 2019,
  • [10] Foreword to the special section
    Duchowski, Andrew
    Krejtz, Krzysztof
    [J]. COMPUTERS & GRAPHICS-UK, 2024, 119
12345