Special issue on packaging and soldering technologies for electronic interconnects - Foreword

被引：1
|
作者：
Ghosh, G
Weiser, M
Mavoori, H
Chada, S
机构：
[1] Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
[2] Honeywell Elect Mat, Spokane, WA 99216 USA
[3] Lucent Technol, Bell Labs, Murray Hill, NJ 07974 USA
[4] Motorola Inc, Plantation, FL 33322 USA
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2000年 / 29卷 / 10期
关键词：
D O I：
10.1007/s11664-000-0001-z
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：1111 / 1112
页数：2
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