Foreword - Special issue on MEMS/NEMS packaging

被引：1

作者：

Lee, YC ^{[1
]}

Chiou, JA

Chen, SC

Jung, E

机构：

[1] Univ Colorado, Boulder, CO 80302 USA

[2] Motorola Inc, Deer Park, IL 60010 USA

[3] Univ Texas, Dept Mech Engn, Austin, TX 78712 USA

[4] Fraunhofer Inst IZM, D-13355 Berlin, Germany

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2003年 / 26卷 / 03期

关键词：

D O I：

10.1109/TADVP.2003.817823

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：215 / 216

页数：2

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