SPECIAL ISSUE: MICRO/NANOELECTRONICS AND NEMS AND MEMS PACKAGING Foreword

被引：0

|

作者：

Basaran, Cemal ^{[1
]}

Ye, Hua ^{[2
]}

机构：

[1] SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA

[2] Microsoft Corp, Redmond, WA 98052 USA

来源：

INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY | 2009年 / 34卷 / 1-2期

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

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页码：1 / 2

页数：2

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