Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package

The heat dissipation capability of embedded wafer-level packaging technology for package-on-package (POP) 3-D integration is reviewed and an effective package level cooling solution for better heat dissipation is proposed. The effects of internal factors (materials and dimensions) on the thermal performance are investigated. Passive cooling solutions are explored in the mobile device scenario for performance improvement. The top cap and the package lid are adopted to enhance the package topside heat conduction and convection. The additional thermal paths provided by the cap and lid can enable better cooling capability. Using the top cap, more than 10% temperature drop can be achieved, without enlarging the footprint size of the POP. The 20- and 28-mm package lid can accommodate 3 and 4 W of heating power, respectively, while maintaining the die temperature under the operation limit. The obtained results and conclusions are expected to aid the 3-D package design.