Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems

被引：14

作者：

Rieutort-Louis, Warren S. A. ^{[1
]}

Sanz-Robinson, Josue ^{[1
]}

Moy, Tiffany ^{[1
]}

Huang, Liechao ^{[1
]}

Hu, Yingzhe ^{[1
]}

Afsar, Yasmin ^{[1
]}

Sturm, James C. ^{[1
]}

Verma, Naveen ^{[1
]}

Wagner, Sigurd ^{[1
]}

机构：

[1] Princeton Univ, Dept Elect Engn, Princeton, NJ 08544 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2015年 / 5卷 / 09期

基金：

美国国家科学基金会;

关键词：

Flexible electronics; integration; noncontact systems; thin film; wireless; FILM-TRANSISTOR CIRCUITS; CMOS ICS; SENSORS; SHEET; ARRAY;

D O I：

10.1109/TCPMT.2015.2448755

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

An approach to creating large-area systems is described that combines flexible thin-film electronic sensor surfaces with complementary metal-oxide-semi-conductor (CMOS) integrated circuits (ICs). Complete systems are built by lamination of multiple layers, consisting of thin-film subsystems and CMOS ICs on a passive flexible substrate. A flexible passive backplane provides in-plane interconnections. Via-type interconnections between stacked layers are made by inductive or capacitive coupling. Steps and testing techniques, from devices and circuits to fully integrated hybrid systems, are illustrated.

引用

页码：1219 / 1229

页数：11

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