Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems

被引：14

作者：

Rieutort-Louis, Warren S. A. ^{[1
]}

Sanz-Robinson, Josue ^{[1
]}

Moy, Tiffany ^{[1
]}

Huang, Liechao ^{[1
]}

Hu, Yingzhe ^{[1
]}

Afsar, Yasmin ^{[1
]}

Sturm, James C. ^{[1
]}

Verma, Naveen ^{[1
]}

Wagner, Sigurd ^{[1
]}

机构：

[1] Princeton Univ, Dept Elect Engn, Princeton, NJ 08544 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2015年 / 5卷 / 09期

基金：

美国国家科学基金会;

关键词：

Flexible electronics; integration; noncontact systems; thin film; wireless; FILM-TRANSISTOR CIRCUITS; CMOS ICS; SENSORS; SHEET; ARRAY;

D O I：

10.1109/TCPMT.2015.2448755

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

An approach to creating large-area systems is described that combines flexible thin-film electronic sensor surfaces with complementary metal-oxide-semi-conductor (CMOS) integrated circuits (ICs). Complete systems are built by lamination of multiple layers, consisting of thin-film subsystems and CMOS ICs on a passive flexible substrate. A flexible passive backplane provides in-plane interconnections. Via-type interconnections between stacked layers are made by inductive or capacitive coupling. Steps and testing techniques, from devices and circuits to fully integrated hybrid systems, are illustrated.

引用

页码：1219 / 1229

页数：11

共 50 条

[21] Large-area, flexible macroelectronics
Reuss, R
[J]. 2002 IEEE/LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2, 2002, : 357 - 358
[22] Facile fabrication of large-area BN films for thermal management in flexible electronics
Gao, Shan
Bai, Xue
Li, Junhong
Han, Mang
Yao, Yimin
Zeng, Xiaoliang
Sun, Rong
Zhang, Ping
[J]. COMPOSITES COMMUNICATIONS, 2022, 36
[23] Flexible Fabrication of Flexible Electronics: A General Laser Ablation Strategy for Robust Large-Area Copper-Based Electronics
Qin, Ruzhan
Hu, Mingjun
Zhang, Naibai
Guo, Zhongyue
Yan, Ze
Li, Jiebo
Liu, Jinzhang
Shan, Guangcun
Yang, Jun
[J]. ADVANCED ELECTRONIC MATERIALS, 2019, 5 (10):
[24] Adapting Large-Area Flexible Hybrid TFT/CMOS Electronics and Display Technology to Create an Optical Sensor Array Architecture
Smith, Jospeh T.
Bawolek, Edward
Trujillo, Jovan
Raupp, Greg
Allee, David R.
Christen, Jennifer Blain
[J]. 2017 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2017, : 1990 - 1993
[25] Polycrystalline silicon thin-film transistor technology for flexible large-area electronics
Tung, YJ
Carey, PG
Smith, PM
Theiss, SD
Wickboldt, P
Meng, XF
Weiss, RE
Davis, GA
Aebi, VW
King, TJ
[J]. FLAT PANEL DISPLAY TECHNOLOGY AND DISPLAY METROLOGY II, 2001, 4295 : 102 - 107
[26] Flexible, Large-Area, and Distributed Organic Electronics Closely Contacted with Skin for Healthcare Applications
Takamiya, Makoto
Fuketa, Hiroshi
Ishida, Koichi
Yokota, Tomoyuki
Sekitani, Tsuyoshi
Someya, Takao
Sakurai, Takayasu
[J]. 2014 IEEE 57TH INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS), 2014, : 829 - 832
[27] Organic Microelectromechanical Relays for Ultralow-Power Flexible Transparent Large-Area Electronics
Pan, Yanbiao
Khan, Nabeela
Lu, Ming
Jeon, Jaeseok
[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2016, 63 (02) : 832 - 840
[28] Printed organic transistors for large-area electronics
Someya, Takao
Sakurai, Takayasu
Sekitani, Tsuyoshi
Noguchi, Yoshiaki
[J]. 6TH INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, PROCEEDINGS 2007, 2007, : 6 - +
[29] Digital lithographic processing for large-area electronics
Wong, William S.
Chabinyc, Michael L.
Limb, Scott
Ready, Steven E.
Lujan, Rene
Daniel, Jurgen
Street, Robert A.
[J]. JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY, 2007, 15 (07) : 463 - 470
[30] Printed organic transistors for large-area electronics
Someya, Takao
Sakurai, Takayasu
Sekitani, Tsuyoshi
[J]. IMID/IDMC 2006: THE 6TH INTERNATIONAL MEETING ON INFORMATION DISPLAY/THE 5TH INTERNATIONAL DISPLAY MANUFACTURING CONFERENCE, DIGEST OF TECHNICAL PAPERS, 2006, : 205 - 208

← 1 2 3 4 5 →