Interfacial reactions between Sn-Ag-Cu-Fe composite solder and Cu substrate

被引：0
|
作者：
Liu, Xiaoying [1 ]
Huang, Mingliang [1 ]
Zhao, Ning [1 ]
机构：
[1] Dalian Univ Technol, Dept Mat Sci & Engn, Dalian, Peoples R China
来源：
MECHATRONICS AND INTELLIGENT MATERIALS III, PTS 1-3 | 2013年 / 706-708卷
关键词：
Composite lead-free solder; Intermetallic compound; Gravity segregation;
D O I：
10.4028/www.scientific.net/AMR.706-708.138
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The growth kinetics and morphology of intermetallic compound (IMC) between Sn-3Ag-0.5Cu -xFe (x= 0, 0.5wt.%, 1 wt.%) composite solders and Cu substrate were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250 degrees C. During soldering process, Fe particles quickly deposited in the vicinity of MC, resulting in the formation of Fe-rich area. It was shown that Fe could effectively retard the growth of interfacial Cu6Sn5 and Cu3Sn layers during liquid-state reaction and reduce the size of Cu6Sn5 grains. Small cracks were observed in the Cu6Sn5 grains of Sn-Ag-Cu/Cu interface after reflowing for 30 min while they were not found in the other composite solders.
引用
收藏
页码：138 / 141
页数：4
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