Interfacial reactions between Sn-Ag-Cu-Fe composite solder and Cu substrate

被引：0
|
作者：
Liu, Xiaoying [1 ]
Huang, Mingliang [1 ]
Zhao, Ning [1 ]
机构：
[1] Dalian Univ Technol, Dept Mat Sci & Engn, Dalian, Peoples R China
来源：
MECHATRONICS AND INTELLIGENT MATERIALS III, PTS 1-3 | 2013年 / 706-708卷
关键词：
Composite lead-free solder; Intermetallic compound; Gravity segregation;
D O I：
10.4028/www.scientific.net/AMR.706-708.138
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The growth kinetics and morphology of intermetallic compound (IMC) between Sn-3Ag-0.5Cu -xFe (x= 0, 0.5wt.%, 1 wt.%) composite solders and Cu substrate were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250 degrees C. During soldering process, Fe particles quickly deposited in the vicinity of MC, resulting in the formation of Fe-rich area. It was shown that Fe could effectively retard the growth of interfacial Cu6Sn5 and Cu3Sn layers during liquid-state reaction and reduce the size of Cu6Sn5 grains. Small cracks were observed in the Cu6Sn5 grains of Sn-Ag-Cu/Cu interface after reflowing for 30 min while they were not found in the other composite solders.
引用
收藏
页码：138 / 141
页数：4
相关论文
共 50 条
  • [41] Morphologies and evolution of intermetallic compounds formed between Sn1.0Ag0.7Cu composite solder and Cu substrate
    Sui, Yan-Wei
    Sun, Ren
    Qi, Ji-Qiu
    He, Ye-Zeng
    Wei, Fu-Xiang
    Meng, Qing-Kun
    Sun, Zhi
    RARE METALS, 2023, 42 (03) : 1043 - 1049
  • [42] Morphologies and evolution of intermetallic compounds formed between Sn1.0Ag0.7Cu composite solder and Cu substrate
    Yan-Wei Sui
    Ren Sun
    Ji-Qiu Qi
    Ye-Zeng He
    Fu-Xiang Wei
    Qing-Kun Meng
    Zhi Sun
    RareMetals, 2023, 42 (03) : 1043 - 1049
  • [43] Effect of Ni to the Cu substrate on the interfacial reaction with Sn-Cu solder
    Maeshima, Takashi
    Ikehata, Hideaki
    Terui, Kenichirou
    Sakamoto, Yoshitsugu
    MATERIALS & DESIGN, 2016, 103 : 106 - 113
  • [44] Morphologies and evolution of intermetallic compounds formed between Sn1.0Ag0.7Cu composite solder and Cu substrate
    Yan-Wei Sui
    Ren Sun
    Ji-Qiu Qi
    Ye-Zeng He
    Fu-Xiang Wei
    Qing-Kun Meng
    Zhi Sun
    Rare Metals, 2023, 42 : 1043 - 1049
  • [45] Interfacial reaction and microstructure between the Sn3Ag0.5Cu solder and Cu–Co dual-phase substrate
    Chao Li
    Xiaowu Hu
    Xiongxin Jiang
    Yulong Li
    Applied Physics A, 2018, 124
  • [46] Interfacial reactions with and without current stressing at Sn–Co/Ag and Sn–Co/Cu solder joints
    Chia-ming Hsu
    Sinn-wen Chen
    Journal of Materials Science, 2013, 48 : 6640 - 6646
  • [47] Identification of phases in Sn-Ag-Cu-In solder on Cu substrate interface
    Sebo, P.
    Svec, P.
    Janickovic, D.
    Moser, Z.
    KOVOVE MATERIALY-METALLIC MATERIALS, 2008, 46 (04): : 235 - 238
  • [48] Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints
    Yoon, Jeong-Won
    Chun, Hyun-Suk
    Jung, Seung-Boo
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2008, 483-84 (1-2 C): : 731 - 734
  • [49] Interfacial reaction kinetics between liquid Sn-Ag-Cu alloys and Cu substrate
    Yuan, Zhangfu, 1600, Science Press (43):
  • [50] Interfacial Reaction Kinetics between Liquid Sn-Ag-Cu Alloys and Cu Substrate
    Xu Hongyan
    Yuan Zhangfu
    RARE METAL MATERIALS AND ENGINEERING, 2014, 43 (12) : 2893 - 2897
12345