Interfacial reactions between Sn-Ag-Cu-Fe composite solder and Cu substrate

被引：0
|
作者：
Liu, Xiaoying [1 ]
Huang, Mingliang [1 ]
Zhao, Ning [1 ]
机构：
[1] Dalian Univ Technol, Dept Mat Sci & Engn, Dalian, Peoples R China
来源：
MECHATRONICS AND INTELLIGENT MATERIALS III, PTS 1-3 | 2013年 / 706-708卷
关键词：
Composite lead-free solder; Intermetallic compound; Gravity segregation;
D O I：
10.4028/www.scientific.net/AMR.706-708.138
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The growth kinetics and morphology of intermetallic compound (IMC) between Sn-3Ag-0.5Cu -xFe (x= 0, 0.5wt.%, 1 wt.%) composite solders and Cu substrate were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250 degrees C. During soldering process, Fe particles quickly deposited in the vicinity of MC, resulting in the formation of Fe-rich area. It was shown that Fe could effectively retard the growth of interfacial Cu6Sn5 and Cu3Sn layers during liquid-state reaction and reduce the size of Cu6Sn5 grains. Small cracks were observed in the Cu6Sn5 grains of Sn-Ag-Cu/Cu interface after reflowing for 30 min while they were not found in the other composite solders.
引用
收藏
页码：138 / 141
页数：4
相关论文
共 50 条
  • [21] Study of Interfacial Reactions between Sn3.5Ag0.5Cu Alloys and Cu Substrate
    Tsao, L. C.
    Chang, S. Y.
    Sun, W. H.
    Yen, S. F.
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 806 - +
  • [22] Solder Volume Effect on Interfacial Reaction between Sn-Ag-Cu/ENImAg Substrate
    Adawiyah, M. A. Rabiatul
    Azlina, O. Saliza
    ADVANCES IN MATERIAL & PROCESSING TECHNOLOGIES CONFERENCE, 2017, 184 : 604 - 610
  • [23] Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate
    Hiroshi Nishikawa
    Jin Yu Piao
    Tadashi Takemoto
    Journal of Electronic Materials, 2006, 35 : 1127 - 1132
  • [24] Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate
    Nishikawa, H
    Piao, JY
    Takemoto, T
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (05) : 1127 - 1132
  • [25] Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate
    Mokhtari, Omid
    Zhou, Shiqi
    Chan, Y. C.
    Nishikawa, Hiroshi
    MATERIALS TRANSACTIONS, 2016, 57 (08) : 1272 - 1276
  • [26] Study of interfacial reactions between Sn-Ag-Cu alloys and Au substrate
    Jao, Chien-Chung
    Yen, Yee-Wen
    Zhang, Shu-Hao
    Lin, Chung-Yung
    Lee, Chiapyng
    INTERNATIONAL JOURNAL OF MATERIALS RESEARCH, 2007, 98 (06) : 496 - 500
  • [27] Interfacial reactions between Cu substrate and Sn–1Ag–0.5Cu solder containing 0.1 wt% Al by dipping method
    Dhafer Abdulameer Shnawah
    Mohd Faizul Mohd Sabri
    Suhana Binti Mohd Said
    Iswadi Jauhari
    Mohammad Hossein Mahdavifard
    Mohamed Bashir Ali Bashir
    Mohamed Hamid Elsheikh
    Journal of Materials Science: Materials in Electronics, 2015, 26 : 8229 - 8239
  • [28] Solder/Substrate Interfacial Reactions in the Sn-Cu-Ni Interconnection System
    H. Yu
    V. Vuorinen
    J. K. Kivilahti
    Journal of Electronic Materials, 2007, 36 : 136 - 146
  • [29] Solder/substrate interfacial reactions in the Sn-Cu-Ni interconnection system
    Yu, H.
    Vuorinen, V.
    Kivilahti, J. K.
    JOURNAL OF ELECTRONIC MATERIALS, 2007, 36 (02) : 136 - 146
  • [30] Effect of Rare Earth Metal Ce Addition to Sn-Ag Solder on Interfacial Reactions with Cu Substrate
    Yoon, Jeong-Won
    Noh, Bo-In
    Jung, Seung-Boo
    METALS AND MATERIALS INTERNATIONAL, 2014, 20 (03) : 515 - 519
12345