Effect of surface finish on interfacial reactions of Cu/Sn-Ag-Cu/Cu(ENIG) sandwich solder joints

被引：0
|
作者：
Yoon, Jeong-Won [1 ]
Jung, Seung-Boo [1 ]
机构：
[1] School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea, Republic of
来源：
Journal of Alloys and Compounds | 2008年 / 448卷 / 1-2期
关键词：
Soldered joints;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
引用
收藏
页码：177 / 184
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