Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints

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[1] Rabiatul Adawiyah, M.A.
[2] Saliza Azlina, O.
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Saliza Azlina, O. (salizaz@uthm.edu.my) | 1600年 / Elsevier Ltd卷 / 740期
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