Design, modeling and simulation of MEMS pressure sensors

被引：3
|
作者：
Geca, Mateusz [1 ]
Kociubinski, Andrzej [1 ]
机构：
[1] Lublin Univ Technol, PL-20618 Lublin, Poland
来源：
PHOTONICS APPLICATIONS IN ASTRONOMY, COMMUNICATIONS, INDUSTRY, AND HIGH-ENERGY PHYSICS EXPERIMENTS 2013 | 2013年 / 8903卷
关键词：
piezoresistive pressure sensor; MEMS; CoventorWare; optimization; finite element method;
D O I：
10.1117/12.2035439
中图分类号：
P1 [天文学];
学科分类号：
0704 ;
摘要：
This paper focuses on the design and analysis of a MEMS piezoresistive pressure sensor. The absolute pressure sensor with a 150 mu m wide and 3 mu m thick silicon membrane is modeled and simulated using CoventorWare (TM) software-profiting from a finite element method (FEM) implemented to determine specific electro-mechanical parameter values characterizing MEMS structure being designed. Optimization of piezoresistor parameters has been also performed to determine optimum dimensions of piezoresistors and their location referred to the center on the pressure sensor diaphragm. The output voltage measured on a piezoresistive Wheatstone bridge has been obtained and compared for two different resistor materials along with and linearity error analysis.
引用
收藏
页数：10
相关论文
共 50 条
  • [21] Modeling and analysis of MEMS capacitive pressure sensors with vertical comb fingers
    Liu, Zhenyu
    Zhu, Yusi
    Du, Lidong
    Zhao, Zhan
    Fang, Zhen
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2023, 29 (06): : 795 - 805
  • [22] Modeling of gold microbeams as strain and pressure sensors for characterizing MEMS packages
    A. Faes
    G. Resta
    F. Solazzi
    B. Margesin
    Microsystem Technologies, 2012, 18 : 1139 - 1145
  • [23] Modeling of gold microbeams as strain and pressure sensors for characterizing MEMS packages
    Faes, A.
    Resta, G.
    Solazzi, F.
    Margesin, B.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2012, 18 (7-8): : 1139 - 1145
  • [24] Fast Analytical Design of Poly-SiGe MEMS Pressure Sensors
    Rochus, V.
    Wang, B.
    Chaudhuri, A. Ray
    Helin, P.
    Severi, S.
    Rottenberg, X.
    2015 16TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2015,
  • [25] Diaphragm Design for MEMS Pressure Sensors using a Data Mining Tool
    Madhavi, K. Y.
    Sumithradevi, K. A.
    Krishna, M.
    Dharani, Andhe
    WORLD CONGRESS ON ENGINEERING, WCE 2011, VOL II, 2011, : 1353 - 1356
  • [26] Fast analytical design of MEMS capacitive pressure sensors with sealed cavities
    Rochus, V.
    Wang, B.
    Tilmans, H. A. C.
    Chaudhuri, A. Ray
    Helin, P.
    Severi, S.
    Rottenberg, X.
    MECHATRONICS, 2016, 40 : 244 - 250
  • [27] Finite element simulation of package stress in transfer molded MEMS pressure sensors
    Krondorfer, R
    Kim, YK
    Kim, J
    Gustafson, CG
    Lommasson, TC
    MICROELECTRONICS RELIABILITY, 2004, 44 (12) : 1995 - 2002
  • [28] Correction: Modeling and analysis of MEMS capacitive pressure sensors with vertical comb fingers
    Zhenyu Liu
    Yusi Zhu
    Lidong Du
    Zhan Zhao
    Zhen Fang
    Microsystem Technologies, 2023, 29 : 807 - 807
  • [29] Design and simulation of a piezoresistive MEMS pressure sensor for marine applications
    Aravamudhan, S
    Bhansali, S
    MULTIPHASE PHENOMENA AND CFD MODELING AND SIMULATION IN MATERIALS PROCESSES, 2004, : 347 - 355
  • [30] Design, modeling and simulation of MEMS-based silicon Microneedles
    Amin, F.
    Ahmed, S.
    6TH VACUUM AND SURFACE SCIENCES CONFERENCE OF ASIA AND AUSTRALIA (VASSCAA-6), 2013, 439
12345