Thermal-aware test scheduling using network-on-chip under multiple clock rates

被引:3
|
作者
Salamy, Hassan [1 ]
Harmanani, Haidar M. [2 ]
机构
[1] SW Texas State Univ, Ingram Sch Engn, San Marcos, TX 78666 USA
[2] Lebanese Amer Univ, Dept Comp Sci, Byblos, Lebanon
关键词
network-on-chip; test scheduling; SoC; ILP; simulated annealing; OPTIMIZATION;
D O I
10.1080/00207217.2012.713016
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The increasing trend in the number of cores on a single chip has led to scalability and bandwidth issues in bus-based communication. Network-on-chip (NoC) techniques have emerged as a solution that provides a much needed flexibility and scalability in the era of multi-cores. This article presents an optimal integer linear programming (ILP) formulation and a simulated annealing (SA) solution to thermal and power-aware test scheduling of cores in an NoC-based SoC using multiple clock rates. The methods have been implemented and results on various benchmarks are presented.
引用
收藏
页码:408 / 424
页数:17
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