INFLUENCE OF NITROGEN ON THERMAL WARPAGE IN CZOCHRALSKI SILICON WAFERS

被引:0
|
作者
Lu Huanming State Key Laboratory of Silicon Material Science
机构
关键词
nitrogenthermal warpagemechanical strengthsilicon wafers;
D O I
暂无
中图分类号
TN304.055 [];
学科分类号
摘要
1INTRODUCTIONFormanyyears,warpageofsiliconwafershasbeenconcernedinverylargescaleintegratedcircuit(VLSI)manufacturing[1-4].Us...
引用
收藏
页码:148 / 150
页数:3
相关论文
共 50 条
  • [1] Influence of nitrogen on thermal warpage in Czochralski silicon wafers
    Lu, HM
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 1999, 9 (02) : 352 - 354
  • [2] Thermal warpage of Czochralski silicon wafers grown under a nitrogen ambience
    Lu, HM
    Yang, DR
    Li, LB
    Ye, ZZ
    Que, DL
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1998, 169 (02): : 193 - 198
  • [3] Thermal warpage of large diameter Czochralski-grown silicon wafers
    Shimizu, Hirofumi
    Aoshima, Takaaki
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1988, 27 (12): : 2315 - 2323
  • [4] THERMAL WARPAGE OF LARGE DIAMETER CZOCHRALSKI-GROWN SILICON-WAFERS
    SHIMIZU, H
    AOSHIMA, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1988, 27 (12): : 2315 - 2323
  • [5] WARPAGE OF CZOCHRALSKI-GROWN SILICON-WAFERS AS AFFECTED BY OXYGEN PRECIPITATION
    SHIMIZU, H
    WATANABE, T
    KAKUI, Y
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1985, 24 (07): : 815 - 821
  • [6] WARPAGE OF CZOCHRALSKI-GROWN SILICON WAFERS AS AFFECTED BY OXYGEN PRECIPITATION.
    Shimizu, Hirofumi
    Watanabe, Tetsuo
    Kakui, Yoshiharu
    Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes, 1985, 24 (07): : 815 - 821
  • [7] Influence of oxygen precipitates on the warpage of annealed silicon wafers
    Yang, DR
    Wang, G
    Xu, J
    Li, DS
    Que, DL
    Funke, C
    Moeller, HJ
    MICROELECTRONIC ENGINEERING, 2003, 66 (1-4) : 345 - 351
  • [8] OXYGEN SOLUTION AND PRECIPITATION EFFECTS ON THERMAL WARPAGE OF SILICON WAFERS
    YOSHIHIRO, N
    OTSUKA, H
    OKU, T
    TAKASU, S
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (11) : C456 - C456
  • [9] Key influence of the thermal history on process-induced defects in Czochralski silicon wafers
    Kissinger, G
    Graf, D
    Lambert, U
    Grabolla, T
    Richter, H
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 1997, 12 (07) : 933 - 937
  • [10] WARPAGE OF SILICON-WAFERS
    LEROY, B
    PLOUGONVEN, C
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (04) : 961 - 970