INFLUENCE OF NITROGEN ON THERMAL WARPAGE IN CZOCHRALSKI SILICON WAFERS

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Lu Huanming State Key Laboratory of Silicon Material Science
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nitrogenthermal warpagemechanical strengthsilicon wafers;
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TN304.055 [];
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1INTRODUCTIONFormanyyears,warpageofsiliconwafershasbeenconcernedinverylargescaleintegratedcircuit(VLSI)manufacturing[1-4].Us...
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页码:148 / 150
页数:3
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