Reliability study on thermal cycling of QFP device solder joints based on morphological optimisation

被引：0

作者：

Liu, Kunpeng ^{[1
]}

Zhang, Wei ^{[1
]}

Qu, Chen ^{[2
]}

Xiang, Gang ^{[2
]}

Wang, Shang ^{[1
]}

Tian, Yanhong ^{[1
]}

机构：

[1] Harbin Inst Technol, State Key Lab Precis Welding & Joining Mat & Stru, Harbin, Peoples R China

[2] Beijing Aerosp Automat Control Inst, Natl Key Lab Aerosp Intelligent Control, Beijing, Peoples R China

来源：

2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2024年

基金：

中国国家自然科学基金;

关键词：

surface evolver; finite element simulation; solder joint; fatigue life; BEHAVIOR;

D O I：

10.1109/ICEPT63120.2024.10668678

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

As a research method with low cost and high accuracy, finite element simulation is widely used in various fields. However, there are still some difficulties in obtaining accurate initial model in some researches. In this paper, Surface Evolver software is used to calculate the initial solder joint model of QFP device by energy minimization principle, and the model is tested experimentally. Then, the solder joint model was imported into the finite element software to establish the QFP device model, and the thermal cycle simulation test at -55-150 degrees C was carried out to obtain the mechanical properties of the solder joint Finally, the fatigue life prediction model is used to calculate the life of solder joints.

引用

页数：4

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