Reliability study on thermal cycling of QFP device solder joints based on morphological optimisation

被引：0

作者：

Liu, Kunpeng ^{[1
]}

Zhang, Wei ^{[1
]}

Qu, Chen ^{[2
]}

Xiang, Gang ^{[2
]}

Wang, Shang ^{[1
]}

Tian, Yanhong ^{[1
]}

机构：

[1] Harbin Inst Technol, State Key Lab Precis Welding & Joining Mat & Stru, Harbin, Peoples R China

[2] Beijing Aerosp Automat Control Inst, Natl Key Lab Aerosp Intelligent Control, Beijing, Peoples R China

来源：

2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2024年

基金：

中国国家自然科学基金;

关键词：

surface evolver; finite element simulation; solder joint; fatigue life; BEHAVIOR;

D O I：

10.1109/ICEPT63120.2024.10668678

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

As a research method with low cost and high accuracy, finite element simulation is widely used in various fields. However, there are still some difficulties in obtaining accurate initial model in some researches. In this paper, Surface Evolver software is used to calculate the initial solder joint model of QFP device by energy minimization principle, and the model is tested experimentally. Then, the solder joint model was imported into the finite element software to establish the QFP device model, and the thermal cycle simulation test at -55-150 degrees C was carried out to obtain the mechanical properties of the solder joint Finally, the fatigue life prediction model is used to calculate the life of solder joints.

引用

页数：4

共 50 条

[41] Thermal reliability of surface mount leadless solder joints
Jih, CE
INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY, 2001, 16 (4-5): : 370 - 378
[42] An investigation on thermal reliability of underfilled PBGA solder joints
Zhang, LJ
Wang, L
Xie, XM
Kempe, W
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2002, 25 (04): : 284 - 288
[43] Study on the Effect of Manual Splitting on Thermal Fatigue Reliability of PBGA Solder Joints
Xie, XiaoChuan
Tang, GuoBao
Chen, JunShuai
Chen, YeJun
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
[44] The Study of Thermal Mechanical Reliability of Different Copper Stud bump Solder Joints
Zhang Jing
Zhang Shanshan
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 738 - 743
[45] Reliability of SnAgCuFe Solder Joints in WLCSP30 Device
Zhang Liang
Guo Yonghuan
Sun Lei
He Chengwen
RARE METAL MATERIALS AND ENGINEERING, 2016, 45 (11) : 2823 - 2826
[46] Comparison of Thermal Cycling Induced Mechanical Property Evolutions in Bulk Solder and Solder Joints
Hasan, S. M. Kamrul
Fahim, Abdullah
Al Ahsan, Mohammad
Suhling, Jeffrey C.
Lall, Pradeep
PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021), 2021, : 999 - 1007
[47] Solder Ball Reliability Assessment of WLCSP - Power Cycling Versus Thermal Cycling
Rahangdale, Unique
Conjeevaram, B.
Doiphode, Aniruddha
Rajmane, Pavan
Misrak, Abel
Sakib, A. R.
Agonafer, Dereje
Nguyen, Luu T.
Lohia, Alok
Kummerl, Steven
PROCEEDINGS OF THE 2017 SIXTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS ITHERM 2017, 2017, : 1361 - 1368
[48] Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability
Xu, Luhua
Pang, John H. L.
Che, Faxing
JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (06) : 880 - 886
[49] Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints
Akbari, Saeed
Lovberg, Andreas
Tegehall, Per-Erik
Brinkfeldt, Klas
Andersson, Dag
MICROELECTRONICS RELIABILITY, 2019, 93 : 61 - 71
[50] Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints during Thermal Cycling
Shen, Chaobo
Hai, Zhou
Zhao, Cong
Zhang, Jiawei
Bozack, M. J.
Suhling, J. C.
Evans, John L.
INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2, 2015,

← 1 2 3 4 5 →