Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages

被引：90
|
作者：
Vandevelde, Bart [1 ]
Gonzalez, Mario [1 ]
Limaye, Paresh [1 ]
Ratchev, Petar [1 ]
Beyne, Eric [1 ]
机构：
[1] IMEC, B-3001 Louvain, Belgium
来源：
MICROELECTRONICS RELIABILITY | 2007年 / 47卷 / 2-3期
关键词：
D O I：
10.1016/j.microrel.2006.09.034
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper deals with a comparison study between SnPb and SnAgCu solder joint reliability. The comparison is based on non-linear finite element modelling. Three packages have been selected: silicon CSP, underfilled flip chip and QFN package. Also the effect of thermal cycling conditions has been investigated. Comparing the induced inelastic strains in the solder joint, the lead-free SnAgCu generally scores better thanks to the lower creep strain rate. On the other hand for the CSP and flip chip package, SnAgCu scores worse for the more extreme loading conditions when the inelastic dissipated energy density is selected as dam-Age parameter. The main reason is that due to the lower creep strain rate, the stresses become higher for SnAgCu resulting in higher hysteresis loops with more dissipated energy per cycle. For the QFN package, SnAgCu scores much better. (c) 2006 Elsevier Ltd. All rights reserved.
引用
收藏
页码：259 / 265
页数：7
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