Adopting multichip-module technology

被引：0

作者：

机构：

来源：

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

共 50 条

[1] KEYNOTE PAPER - MULTICHIP-MODULE TECHNOLOGY
RINNE, RA
BARBOUR, DR
AMERICAN CERAMIC SOCIETY BULLETIN, 1983, 62 (08): : 875 - 875
[2] ADOPTING MULTICHIP-MODULE TECHNOLOGY - GOING TO MCMS ISNT AS SCARY AS ITS SEEMS ANYMORE
TASKER, SC
SEKULIC, Z
ELECTRONIC DESIGN, 1994, 42 (13) : 153 - &
[3] LOW-COST DEVELOPMENTS SURFACE FOR MULTICHIP-MODULE TECHNOLOGY
MALINIAK, D
ELECTRONIC DESIGN, 1992, 40 (22) : 28 - 28
[4] THE HOW AND WHY OF MULTICHIP-MODULE TESTING
POSSE, K
EE-EVALUATION ENGINEERING, 1994, 33 (09): : 94 - &
[5] ANALYZING MULTICHIP-MODULE TESTING STRATEGIES
ABADIR, MS
PARIKH, AR
SANDBORN, PA
DRAKE, K
BAL, L
IEEE DESIGN & TEST OF COMPUTERS, 1994, 11 (01): : 40 - 52
[6] SMART-SUBSTRATE MULTICHIP-MODULE SYSTEMS
MALY, W
FELTHAM, DBI
GATTIKER, AE
HOBAUGH, MD
BACKUS, K
THOMAS, ME
IEEE DESIGN & TEST OF COMPUTERS, 1994, 11 (02): : 64 - 73
[7] THE MULTICHIP-MODULE AS A BOARD-LEVEL PACKAGE
KNORR, DB
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1995, 47 (06): : 27 - 30
[8] Multichip-Module fuer ein HDTV-Speichersubsystem
1600, (06):
[9] POWER CYCLING AND STRESS VARIATION IN A MULTICHIP-MODULE
SUR, B
TURLIK, I
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (02): : 388 - 395
[10] PRESENT AND FUTURE-DIRECTIONS FOR MULTICHIP-MODULE TECHNOLOGIES
SUDO, T
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1995, 30 (04) : 436 - 442