共 50 条
- [31] PHOTOTHERMAL FORMATION OF COPPER CONDUCTORS ON MULTICHIP-MODULE SUBSTRATES USING A ND-YAG LASER IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (05): : 530 - 535
- [32] MULTICHIP TECHNOLOGY FINDS WAY INTO TELECOM MODULE ELECTRONIC PRODUCTS MAGAZINE, 1991, 34 (05): : 18 - +
- [34] COMPARISON OF METHODS FOR DETERMINING THE CAPACITANCE OF PLANAR TRANSMISSION-LINES WITH APPLICATION TO MULTICHIP-MODULE CHARACTERIZATION IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (03): : 247 - 252
- [35] FABRICATION OF LOW-LOSS POLYIMIDE OPTICAL WAVE-GUIDES USING THIN-FILM MULTICHIP-MODULE PROCESS TECHNOLOGY IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (02): : 232 - 234
- [36] Application and simulation technology of multichip module packaging 2005 INTERNATIONAL CONFERENCE ON COMMUNICATIONS, CIRCUITS AND SYSTEMS, VOLS 1 AND 2, PROCEEDINGS: VOL 1: COMMUNICATION THEORY AND SYSTEMS, 2005, : 1211 - 1214
- [37] Holistic Die-to-Die Interface Design Methodology for 2.5-D Multichip-Module Systems IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (12): : 2171 - 2182
- [38] FINITE-DIFFERENCE TIME-DOMAIN ANALYSIS OF PULSE-PROPAGATION IN MULTICHIP-MODULE INTERCONNECTS IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (05): : 490 - 498
- [39] A SILICON-ON-SILICON FIELD-PROGRAMMABLE MULTICHIP-MODULE (FPMCM) - INTEGRATING FPGA AND MCM TECHNOLOGIES IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (04): : 601 - 608
- [40] An investigation into the design flow problems in multichip module technology ADVANCES IN MANUFACTURING TECHNOLOGY XII, 1998, : 17 - 22