Adopting multichip-module technology

被引：0
|
作者：
机构：
来源：
Electronic Design | 1994年 / 42卷 / 13期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] MULTICHIP-MODULE SELF-TEST PROVIDES MEANS TO TEST AT SPEED
    FLINT, A
    EE-EVALUATION ENGINEERING, 1995, 34 (09): : 46 - &
  • [22] MODELING INTERMEDIATE TESTS FOR FAULT-TOLERANT MULTICHIP-MODULE SYSTEMS
    KIM, S
    LOMBARDI, F
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (03): : 448 - 455
  • [23] MULTICHIP-MODULE TECHNOLOGY WILL DRIVE EDA EVOLUTION - SYSTEMS LED BY MCM TECHNOLOGY WILL NEED MULTIDIMENSIONAL CONSTRAINT-DRIVEN DESIGN
    KHANNA, S
    ELECTRONIC DESIGN, 1992, 40 (01) : 99 - &
  • [24] THERMAL DESIGN FOR HIGH-SPEED HIGH-DENSITY MULTICHIP-MODULE
    HANDA, T
    IIDA, S
    UTSUNOMIYA, J
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (04): : 384 - 387
  • [25] OFF-CHIP SUPERCONDUCTOR WIRING IN MULTICHIP-MODULE FOR JOSEPHSON LSI CIRCUIT
    TANAHASHI, S
    KUBO, T
    JIKUHARA, R
    KAJI, G
    TERASAWA, M
    TACANO, M
    NAKAGAWA, H
    AOYAGI, M
    KUROSAWA, I
    TAKADA, S
    IEICE TRANSACTIONS ON ELECTRONICS, 1994, E77C (08) : 1157 - 1163
  • [26] A COMPUTER-AIDED-DESIGN TOOL FOR ROBUST MULTICHIP-MODULE PACKAGE DESIGN
    KATRAGADDA, P
    BHATTACHARYA, S
    GROSSE, IR
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (03): : 383 - 394
  • [27] FREQUENCY-DOMAIN (1KHZ-40GHZ) CHARACTERIZATION OF THIN-FILMS FOR MULTICHIP-MODULE PACKAGING TECHNOLOGY
    LIU, WT
    COCHRANE, S
    WU, XM
    SINGH, PK
    ZHANG, X
    KNORR, DB
    MCDONALD, JF
    RYMASZEWSKI, EJ
    BORREGO, JM
    LU, TM
    ELECTRONICS LETTERS, 1994, 30 (02) : 117 - 118
  • [28] KEYNOTE ADDRESS - MULTICHIP MODULE TECHNOLOGY
    RINNE, RA
    BARBOUR, DR
    AMERICAN CERAMIC SOCIETY BULLETIN, 1982, 61 (08): : 806 - 806
  • [29] LIQUID COOLING PERFORMANCE FOR A 3-D MULTICHIP-MODULE AND MINIATURE HEAT SINK
    VOGEL, MR
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1995, 18 (01): : 68 - 73
  • [30] THE STATUS-QUO AND TRENDS IN THE DEVELOPMENT OF A MULTICHIP-MODULE FOR ATM SWITCHING-SYSTEM
    KIKKAWA, T
    IKEDA, R
    HIGAKE, M
    NEC RESEARCH & DEVELOPMENT, 1995, 36 (02): : 293 - 302
12345