共 50 条
- [32] Warpage Measurements of Printed Circuit Board during Reflow Process Using Strain Gauges 2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2014, : 397 - 400
- [34] Dropping Simulation of Printed Circuit Board with BGA Soldering Assembly for Optical Module Application PROCEEDINGS OF 2016 INTERNATIONAL CONFERENCE ON MODELING, SIMULATION AND OPTIMIZATION TECHNOLOGIES AND APPLICATIONS (MSOTA2016), 2016, 58 : 477 - 479
- [35] Assessment of the corrosivity of soldering flux residues using printed copper circuit board tracks Soldering and Surface Mount Technology, 1989, (02): : 22 - 29
- [36] Soldering of Integrated Switching Circuit Board and Printed Boards within an Electronic Watch. F&M. Feinwerktechnik & Messtechnik, 1982, 90 (07): : 329 - 332
- [37] Reducing Lead-free Soldering Failures Caused by Printed Circuit Board Shrinkage 2013 IEEE 19TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME), 2013, : 65 - 68
- [40] Investigation of moisture uptake into printed circuit board laminate and solder mask materials Journal of Materials Science: Materials in Electronics, 2017, 28 : 6138 - 6151