共 50 条
- [41] Printed-circuit board Model Establishment and Solder joint Failure Analysis 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
- [42] TESTING OF PRINTED-CIRCUIT BOARD SOLDER JOINTS BY SPECKLE CORRELATION TECHNIQUES OPTICS AND LASER TECHNOLOGY, 1990, 22 (04): : 260 - 262
- [43] Detection of plated through hole defects in printed circuit board with X-ray 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
- [45] Electroless Plated Copper Thin Film for Metallization on Printed Circuit Board : Neutral Process KOREAN JOURNAL OF MATERIALS RESEARCH, 2013, 23 (11): : 661 - 665
- [46] Mapping of solder mask covered interconnects on high density printed circuit board EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 885 - 888
- [48] Surface property of passivation layer on integrated circuit chip and solder mask layer on printed circuit board IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2003, 26 (04): : 345 - 351
- [49] Optimum design of printed circuit board to reduce deformation in reflow process by a global optimization method MATERIALS & DESIGN, 2012, 33 : 164 - 174
- [50] Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-Free Soldering IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2010, 33 (02): : 98 - 111