Resistance reflow-soldering of insulated wire to solder plated printed circuit board

被引：0
|
作者：
Sasaki, Hideaki
Tani, Mitsukiyo
机构：
来源：
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society | 1993年 / 11卷 / 04期
关键词：
Soldering;
D O I：
10.2207/qjjws.11.583
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：583 / 588
相关论文
共 50 条
  • [21] Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering
    Ma, Geng
    Huang, Xiaoqing
    Liu, Shihao
    IEEE ACCESS, 2021, 9 : 141876 - 141889
  • [22] Effect of Reflow Process on Glass Transition Temperature of Printed Circuit Board Laminates
    Lall, Pradeep
    Narayan, Vikalp
    Suhling, Jeff
    Blanche, Jim
    Strickland, Mark
    2012 13TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2012, : 261 - 268
  • [23] PRINTED CIRCUIT BOARD CLEANING AGENTS AND SOLDERING FLUXES: CFC ALTERNATIVES.
    Bernier, Dennis
    Electronic Manufacturing, 1988, 34 (08): : 29 - 31
  • [24] Reflow Soldering as a Contacting Method for Joining Flat Conductors with Flat Printed Circuit Boards.
    Richter, Dieter
    Rank, Winfried
    Schweisstechnik (Berlin), 1973, 23 (09): : 403 - 405
  • [25] Contamination profile on typical printed circuit board assemblies vs soldering process
    Conseil, Helene
    Jellesen, Morten Stendahl
    Ambat, Rajan
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2014, 26 (04) : 194 - 202
  • [26] Inspection System of Soldering Joint on Printed Circuit Board by Using Neural Network
    Oe, Shunichiro
    Kaida, Kennichi
    Nagai, Daisuke
    Nakamura, Mituo
    Kimura, Tomohiro
    Kameyama, Koichi
    Journal of Robotics and Mechatronics, 1995, 7 (03): : 225 - 229
  • [27] INTERACTION BETWEEN TECHNOLOGY AND ORGANIZATION IN LINING UP AND SOLDERING OF PRINTED CIRCUIT BOARD
    SCHUTZ, G
    MASCHINENBAUTECHNIK, 1975, 24 (11): : 523 - 523
  • [28] Effect of Stiffening the Printed Circuit Board in the Fatigue Life of the Solder Joint
    Doranga, Sushil
    Schuldt, Matthew
    Khanal, Mukunda
    MATERIALS, 2022, 15 (18)
  • [29] Effect of the Surface Morphology of Plated Printed Circuit Board on the Reliability of LED Packages
    Kim, Ho-Young
    Kim, Min Su
    Song, Yong Seon
    Lee, Kwang Hee
    Oh, Jeong Tak
    Park, Kwang Ho
    Jeong, Hwan-Hee
    Seong, Tae-Yeon
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2020, 9 (06)
  • [30] Dependence of Solder Joint Reliability on Solder Volume, Composition and Printed Circuit Board Surface Finish
    Arfaei, Babak
    Mutuku, Francis
    Sweatman, Keith
    Lee, Ning-Cheng
    Cotts, Eric
    Coyle, Richard
    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 655 - 665
12345