AEROSOL PACKAGING.

被引：0

作者：

Weston, Larry ^{[1
]}

机构：

[1] John R. Nabach Engineering Co, John R. Nabach Engineering Co

来源：

Packaging Boston, Mass. | 1987年 / 32卷 / 05期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：152 / 153

共 50 条

[21] BACKPANEL DESIGN: AN EVOLUTION IN PACKAGING.
Markstein, Howard W.
Electronic Packaging and Production, 1974, 14 (11):
[22] Trends in area array packaging.
Goodman, TW
Vardaman, EJ
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1996, 211 : 195 - POLY
[23] Packaging. Reduce, recycle, or what?
Miller, Chaz
Waste Age, 1994, 25 (02):
[24] HEAT PIPES IN ELECTRONIC PACKAGING.
Basiulis, A.
Sekhon, K.S.
1978, 18 (11): : 126 - 133
[25] Clear PPO in microwave packaging.
不详
MODERN PLASTICS, 2000, 77 (05): : 133 - 133
[26] Barrier coatings for food packaging.
Lopata, ES
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1997, 213 : 494 - POLY
[27] Highly transparent PP packaging.
Schlotmann, R
KUNSTSTOFFE-PLAST EUROPE, 1998, 88 (06): : 868 - 869
[28] TOLERANCE ANALYSIS IN ELECTRONIC PACKAGING.
Velsher, B.
Electronic Packaging and Production, 1987, 27 (04): : 76 - 78
[29] HIGH DENSITY ELECTRONICS PACKAGING.
Schwartz, Walter H.
Assembly engineering, 1988, 31 (02): : 30 - 33
[30] STRESS ANALYSIS IN ELECTRONIC PACKAGING.
Engel, P.A.
Lim, C.K.
Finite elements in analysis and design, 1988, 4 (01) : 9 - 18