共 50 条
- [43] BACKPANELS FOR HIGH-DENSITY PACKAGING. Electronic Packaging and Production, 1980, 20 (03): : 41 - 42
- [44] REED RELAYS AND THEIR HIGH DENSITY PACKAGING. JEE, Journal of Electronic Engineering, 1982, 19 (191): : 75 - 77
- [48] KEEPING PACE WITH THE OPTIONS IN IC PACKAGING. Design News (Boston), 1985, 41 (12): : 139 - 142
- [49] DROP IMPACT ANALYSIS OF SPENT FUEL PACKAGING. FAPIG (First Atomic Power Industry Group), 1988, (118): : 18 - 24
- [50] OPTICAL I/O HYBRID MICROELECTRONICS PACKAGING. SME Technical Paper (Series) EE, 1979, (EE79-23):