STRESS ANALYSIS IN ELECTRONIC PACKAGING.

被引：0

作者：

Engel, P.A. ^{[1
]}

Lim, C.K. ^{[1
]}

机构：

[1] IBM, Endicott, NY, USA, IBM, Endicott, NY, USA

来源：

关键词：

D O I：

10.1016/0168-874X(88)90020-0

中图分类号：

学科分类号：

摘要：

引用

页码：9 / 18

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