HEAT PIPES IN ELECTRONIC PACKAGING.

被引：0
|
作者：
Basiulis, A.
Sekhon, K.S.
机构：
来源：
| 1978年 / 18卷 / 11期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Heat pipes have been considered as ideal for removing heat from densely packaged equipment. With today's increased accent on high-density electronic packaging heat pipes may become the only efficient cooling technique for such applications. Heat pipes can transport heat from the source to the sink without the external power requirements necessary for fans or liquid cooling systems. They can also act as structural members and temperature controllers.
引用
收藏
页码：126 / 133
相关论文
共 50 条
  • [1] TOLERANCE ANALYSIS IN ELECTRONIC PACKAGING.
    Velsher, B.
    Electronic Packaging and Production, 1987, 27 (04): : 76 - 78
  • [2] STRESS ANALYSIS IN ELECTRONIC PACKAGING.
    Engel, P.A.
    Lim, C.K.
    Finite elements in analysis and design, 1988, 4 (01) : 9 - 18
  • [3] SANDWICH HEAT SINKS WITH HYBRID COOLING FOR HIGH POWER ELECTRONIC COMPONENT PACKAGING.
    Chan, J.Y.
    Pennell, G.F.
    Varmha, R.
    1600, (27):
  • [4] SYSTEM PACKAGING.
    Ormond, Tom
    Hovancik, Ron
    McGrath, James L.
    EDN, 1982, 27 (03) : 113 - 116
  • [5] TRENDS IN PACKAGING.
    Val, Christian M.
    International Journal of Microcircuits and Electronic Packaging, 1984, 7 (02): : 21 - 34
  • [6] APPLICATION OF STATISTICAL METHODS TO THERMAL DESIGN IN ELECTRONIC PACKAGING.
    Keller, Charles J.
    International Journal of Microcircuits and Electronic Packaging, 1984, 7 (03): : 51 - 54
  • [7] Food packaging.
    Niessner, N
    KUNSTSTOFFE-PLAST EUROPE, 1998, 88 (06): : 874 - +
  • [8] PLASTICS IN PACKAGING.
    Anon
    Plastics Engineering, 1978, 34 (10) : 29 - 51
  • [9] COMPONENT PACKAGING.
    Bailey, John
    1978, 22 (06): : 45 - 50
  • [10] PLASTICS IN PACKAGING.
    Dorairaj, V.
    Chemical Age of India, 1988, 39 (03): : 165 - 167
12345