HEAT PIPES IN ELECTRONIC PACKAGING.

被引：0
|
作者：
Basiulis, A.
Sekhon, K.S.
机构：
来源：
| 1978年 / 18卷 / 11期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Heat pipes have been considered as ideal for removing heat from densely packaged equipment. With today's increased accent on high-density electronic packaging heat pipes may become the only efficient cooling technique for such applications. Heat pipes can transport heat from the source to the sink without the external power requirements necessary for fans or liquid cooling systems. They can also act as structural members and temperature controllers.
引用
收藏
页码：126 / 133
相关论文
共 50 条
  • [41] Plastics in packaging. An environmental law perspective
    Garg, S.K.
    Polymer Preprints, Division of Polymer Chemistry, American Chemical Society, 1993, 34 (01):
  • [42] Metallized Plastics Films for Food Packaging.
    Dulin, Cyril I.
    Kunststoffe Plastics Monatliche Ausg., 1984, 31 (03): : 12 - 15
  • [43] SURFACE-MOUNTED SEMICONDUCTOR PACKAGING.
    Marston, Peter
    New Electronics, 1983, 16 (09):
  • [44] AESTHETIC SIDE OF DIESEL ENGINE PACKAGING.
    Graf, Robert E.
    Diesel progress North American, 1982, 48 (08): : 36 - 39
  • [45] Social packaging. Design for wide sustainability
    Bozzola, Marco
    De Giorgi, Claudia
    DESIGN JOURNAL, 2019, 22 : 737 - 749
  • [46] HIGH PERFORMANCE MMIC HERMETIC PACKAGING.
    Ziegner, Bernhard A.
    Microwave journal, 1986, 29 (11): : 133 - 134
  • [47] BACKPANELS FOR HIGH-DENSITY PACKAGING.
    Markstein, Howard W.
    Electronic Packaging and Production, 1980, 20 (03): : 41 - 42
  • [48] REED RELAYS AND THEIR HIGH DENSITY PACKAGING.
    Yamakoshi, Kazuya
    JEE, Journal of Electronic Engineering, 1982, 19 (191): : 75 - 77
  • [49] CERAMIC CHIP CARRIERS - A NEW STANDARD IN PACKAGING.
    Bailey, B.
    1600, (52):
  • [50] COMPUTER SIMULATION TO OPTIMIZE PAINT PACKAGING.
    Gebauer, David L.
    Wiborg, Jon N.
    1600, (48):
12345