HEAT PIPES IN ELECTRONIC PACKAGING.

被引：0
|
作者：
Basiulis, A.
Sekhon, K.S.
机构：
来源：
| 1978年 / 18卷 / 11期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Heat pipes have been considered as ideal for removing heat from densely packaged equipment. With today's increased accent on high-density electronic packaging heat pipes may become the only efficient cooling technique for such applications. Heat pipes can transport heat from the source to the sink without the external power requirements necessary for fans or liquid cooling systems. They can also act as structural members and temperature controllers.
引用
收藏
页码：126 / 133
相关论文
共 50 条
  • [31] Synthesis and characterizations of a controlled thermally degradable epoxy resin system for electronic packaging.
    Li, HY
    Wang, LJ
    Jacob, KI
    Wong, CP
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2000, 220 : U371 - U371
  • [32] Barrier coatings for food packaging.
    Lopata, ES
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1997, 213 : 494 - POLY
  • [33] Highly transparent PP packaging.
    Schlotmann, R
    KUNSTSTOFFE-PLAST EUROPE, 1998, 88 (06): : 868 - 869
  • [34] HIGH DENSITY ELECTRONICS PACKAGING.
    Schwartz, Walter H.
    Assembly engineering, 1988, 31 (02): : 30 - 33
  • [35] PLASTICS AND METALS: CHOICES IN PACKAGING.
    Heathcoat, M.J.
    Sheet Metal Industries, 1988, 65 (05): : 251 - 252
  • [36] DNA condensation and viral packaging.
    Gelbart, WM
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2001, 221 : U248 - U248
  • [37] PHYSICAL DESIGN AND PACKAGING - 4. MATERIALS FOR PACKAGING.
    Brooks, Phil
    EDN, 1973, 18 (20) : 56 - 61
  • [38] 6 HOTTEST TRENDS IN FOOD PACKAGING.
    Bertrand, Kate
    Packaging Boston, Mass., 1986, 31 (01): : 24 - 30
  • [39] Acrylonitrile Copolymers for Food Product Packaging.
    Eagleton, S.D.
    1978, 25 (02): : 33 - 39
  • [40] IMPROVED BARRIER PROPERTIES FOR FLEXIBLE PACKAGING.
    Anon
    Packaging Boston, Mass., 1986, 31 (03): : 72 - 74
12345