HEAT PIPES IN ELECTRONIC PACKAGING.

被引：0
|
作者：
Basiulis, A.
Sekhon, K.S.
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来源：
| 1978年 / 18卷 / 11期
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摘要：
Heat pipes have been considered as ideal for removing heat from densely packaged equipment. With today's increased accent on high-density electronic packaging heat pipes may become the only efficient cooling technique for such applications. Heat pipes can transport heat from the source to the sink without the external power requirements necessary for fans or liquid cooling systems. They can also act as structural members and temperature controllers.
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页码：126 / 133
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