INNOVATIONS IN HYBRID PACKAGING.

被引：0
|
作者：
Markstein, Howard W.
机构：
来源：
Electronic Packaging and Production | 1979年 / 19卷 / 09期
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
INTEGRATED CIRCUITS, HYBRID
引用
收藏
页码：42 / 44
相关论文
共 50 条
  • [1] OPTICAL I/O HYBRID MICROELECTRONICS PACKAGING.
    Peterson, Gary J.
    SME Technical Paper (Series) EE, 1979, (EE79-23):
  • [2] SYSTEM PACKAGING.
    Ormond, Tom
    Hovancik, Ron
    McGrath, James L.
    EDN, 1982, 27 (03) : 113 - 116
  • [3] TRENDS IN PACKAGING.
    Val, Christian M.
    International Journal of Microcircuits and Electronic Packaging, 1984, 7 (02): : 21 - 34
  • [4] Food packaging.
    Niessner, N
    KUNSTSTOFFE-PLAST EUROPE, 1998, 88 (06): : 874 - +
  • [5] PLASTICS IN PACKAGING.
    Anon
    Plastics Engineering, 1978, 34 (10) : 29 - 51
  • [6] COMPONENT PACKAGING.
    Bailey, John
    1978, 22 (06): : 45 - 50
  • [7] PLASTICS IN PACKAGING.
    Dorairaj, V.
    Chemical Age of India, 1988, 39 (03): : 165 - 167
  • [8] TIN AND PACKAGING.
    Evans, Colin J.
    Tin and Its Uses, 1986, (148): : 1 - 3
  • [9] AEROSOL PACKAGING.
    Weston, Larry
    Packaging Boston, Mass., 1987, 32 (05): : 152 - 153
  • [10] Packaging. Phosphors and White LED Packaging
    Xie, Rong-Jun
    Hirosaki, Naoto
    III-NITRIDE BASED LIGHT EMITTING DIODES AND APPLICATIONS, 2013, 126 : 291 - +
12345