INNOVATIONS IN HYBRID PACKAGING.

被引：0

作者：

Markstein, Howard W.

机构：

来源：

Electronic Packaging and Production | 1979年 / 19卷 / 09期

关键词：

Compendex;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

INTEGRATED CIRCUITS, HYBRID

引用

页码：42 / 44

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