INNOVATIONS IN HYBRID PACKAGING.

被引：0
|
作者：
Markstein, Howard W.
机构：
来源：
Electronic Packaging and Production | 1979年 / 19卷 / 09期
关键词：
Compendex;
D O I：
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学科分类号：
摘要：
INTEGRATED CIRCUITS, HYBRID
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页码：42 / 44
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