AEROSOL PACKAGING.

被引:0
|
作者
Weston, Larry [1 ]
机构
[1] John R. Nabach Engineering Co, John R. Nabach Engineering Co
来源
Packaging Boston, Mass. | 1987年 / 32卷 / 05期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:152 / 153
相关论文
共 50 条
  • [1] Aerosol Valve - More than a Means for Packaging.
    Tauscher, Wolfgang
    Verpackungs - Rundschau, 1973, 24 (06): : 861 - 862
  • [2] SYSTEM PACKAGING.
    Ormond, Tom
    Hovancik, Ron
    McGrath, James L.
    EDN, 1982, 27 (03) : 113 - 116
  • [3] TRENDS IN PACKAGING.
    Val, Christian M.
    International Journal of Microcircuits and Electronic Packaging, 1984, 7 (02): : 21 - 34
  • [4] Food packaging.
    Niessner, N
    KUNSTSTOFFE-PLAST EUROPE, 1998, 88 (06): : 874 - +
  • [5] PLASTICS IN PACKAGING.
    Anon
    Plastics Engineering, 1978, 34 (10) : 29 - 51
  • [6] COMPONENT PACKAGING.
    Bailey, John
    1978, 22 (06): : 45 - 50
  • [7] PLASTICS IN PACKAGING.
    Dorairaj, V.
    Chemical Age of India, 1988, 39 (03): : 165 - 167
  • [8] TIN AND PACKAGING.
    Evans, Colin J.
    Tin and Its Uses, 1986, (148): : 1 - 3
  • [9] Packaging. Phosphors and White LED Packaging
    Xie, Rong-Jun
    Hirosaki, Naoto
    III-NITRIDE BASED LIGHT EMITTING DIODES AND APPLICATIONS, 2013, 126 : 291 - +
  • [10] MILITARY MICROCIRCUIT PACKAGING.
    Brauer, Joseph B.
    Electronic Engineer (Philadelphia) (Changed to EE/Systems Engineering today, 1972, 31 (07): : 30 - 31