Aerosol Valve - More than a Means for Packaging.

被引:0
|
作者
Tauscher, Wolfgang
机构
来源
Verpackungs - Rundschau | 1973年 / 24卷 / 06期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
The author uses this heading to describe and to deal with the function of the technological unit obeying physical flow laws. He discusses the long time resistance and permanent use function of a valve/spray head system as well as corrosion behavior and vapor phase hole characteristics. Correct choice of the aerosol system and valve techniques contributes to optimization of life and function of an aerosol unit.
引用
收藏
页码:861 / 862
相关论文
共 50 条
  • [1] AEROSOL PACKAGING.
    Weston, Larry
    Packaging Boston, Mass., 1987, 32 (05): : 152 - 153
  • [2] SYSTEM PACKAGING.
    Ormond, Tom
    Hovancik, Ron
    McGrath, James L.
    EDN, 1982, 27 (03) : 113 - 116
  • [3] TRENDS IN PACKAGING.
    Val, Christian M.
    International Journal of Microcircuits and Electronic Packaging, 1984, 7 (02): : 21 - 34
  • [4] Food packaging.
    Niessner, N
    KUNSTSTOFFE-PLAST EUROPE, 1998, 88 (06): : 874 - +
  • [5] PLASTICS IN PACKAGING.
    Anon
    Plastics Engineering, 1978, 34 (10) : 29 - 51
  • [6] COMPONENT PACKAGING.
    Bailey, John
    1978, 22 (06): : 45 - 50
  • [7] PLASTICS IN PACKAGING.
    Dorairaj, V.
    Chemical Age of India, 1988, 39 (03): : 165 - 167
  • [8] TIN AND PACKAGING.
    Evans, Colin J.
    Tin and Its Uses, 1986, (148): : 1 - 3
  • [9] Packaging. Phosphors and White LED Packaging
    Xie, Rong-Jun
    Hirosaki, Naoto
    III-NITRIDE BASED LIGHT EMITTING DIODES AND APPLICATIONS, 2013, 126 : 291 - +
  • [10] MILITARY MICROCIRCUIT PACKAGING.
    Brauer, Joseph B.
    Electronic Engineer (Philadelphia) (Changed to EE/Systems Engineering today, 1972, 31 (07): : 30 - 31