STRESS ANALYSIS IN ELECTRONIC PACKAGING.

被引：0
|
作者：
Engel, P.A. [1 ]
Lim, C.K. [1 ]
机构：
[1] IBM, Endicott, NY, USA, IBM, Endicott, NY, USA
来源：
Finite elements in analysis and design | 1988年 / 4卷 / 01期
关键词：
D O I：
10.1016/0168-874X(88)90020-0
中图分类号：
学科分类号：
摘要：
8
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页码：9 / 18
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