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- [24] Advanced Wire Bonding Technology for Ag Wire 2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
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- [27] Bonding mechanism in gold wire crescent bonding JOINING OF ADVANCED AND SPECIALTY MATERIALS VI, 2004, : 150 - 158
- [28] Experimental studies on bonding pressure in wire bonding 2006 CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP '06), PROCEEDINGS, 2006, : 176 - +
- [29] Effect of Continuous Casting Parameters on Microstructure and Texture of Gold Bonding Wire for Semiconductor Packaging ADVANCED MATERIALS AND PROCESSING, 2007, 26-28 : 589 - +